Automatic Glue Machine Dispensing Needle

Automatic Glue Machine Dispensing Needle

Product Specification Product Show Dispensing machine dispensing common defects if not dealt with in time will easily cause quality problems of production, and even affect the electrical performance, including wire drawing, tailing, glue point size discontinuity, glue point and satellite glue...

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Description

Product Specification

Product name	Automatic glue machine dispensing needle
Material	Stainless steel, etc.
Inside diameter	0.1-0.8 mm or customized diameter
Properties	High precision dispensing, micro dispensing.
Custom feature	According to your 2D/3D Drawing or sample provided
Package	Standard carton or according to customer's requirement
Certification	ISO13485

Product Show

Dispensing machine dispensing common defects if not dealt with in time will easily cause quality problems of production, and even affect the electrical performance, including wire drawing, tailing, glue point size discontinuity, glue point and satellite glue point and other problems,

Glue pulling and trailing is a common phenomenon in the drip coating process, and even the glue specially prepared for high-speed drip may have the phenomenon of wire drawing, the glue is easier to fall off, and may cause welding. This may be because the process parameters of the dispensing machine equipment are not adjusted in place, such as the inner diameter of the needle is too small, the dispensing pressure is too high, the distance between the needle and PCB is too large, etc.

Another reason, it is possible to understand the performance of the patch glue is not enough, the patch glue and the application process is not compatible, or the quality of the patch glue is not good, viscosity changes or has expired. Other causes can also cause wire drawing/trailing, such as electrostatic discharge of the board, bending of the board, or insufficient support of the board.

According to the above reasons, the process parameters can be adjusted, the needle with a larger inner diameter can be replaced, the dispensing pressure can be reduced, and the height of the needle from the PCB can be adjusted; At the same time, check the delivery date of the patch glue, the performance and use requirements of the glue, whether it is suitable for the coating process. If the patch glue does deteriorate, it can be replaced. In addition, practice has proved that the best way to control the drawing/trailing is to heat the needle on or near the drop glue, reduce the viscosity, the patch glue is easy to disconnect, no drawing/trailing.

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