Copper properties: physical properties

Trace impurities in red copper have serious influence on the conductivity and thermal conductivity of copper. Among them, titanium, phosphorus, iron and silicon significantly reduce the electrical conductivity, while cadmium and zinc have little effect. The solid solubility of oxygen, sulfur, selenium and tellurium in copper is very small, and they can form brittle compounds with copper, which have little effect on electrical conductivity, but can reduce machining plasticity. When ordinary copper is heated in a reductive atmosphere containing hydrogen or carbon monoxide, hydrogen or carbon monoxide can easily react with Cu2O at the grain boundary to produce high-pressure water vapor or carbon dioxide gas, which can break copper. This phenomenon is often called the "hydrogen disease" of copper. Oxygen is harmful to the weldability of copper. Bismuth or lead and copper form eutectic with low melting point, which makes copper brittle. The brittle bismuth distributed along grain boundaries as a thin film made copper brittle. Phosphorus can significantly reduce the electrical conductivity of copper, but improve the fluidity of copper liquid and improve weldability. Proper amount of lead, tellurium and sulfur can improve machinability. The tensile strength, elongation and Brinell hardness of red copper annealed sheet are 22 ~ 25 kg/mm 2, 45 ~ 50% and 35 ~ 45 respectively at room temperature.

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